Porous Silicon Carbide Vacuum Chuck Sheet for Wafer Dicing Semiconductor Processing

The Silicon Carbide (SiC) Vacuum Chuck is a high-precision, industrial-grade component engineered for secure, non-damaging holding of workpieces in precision manufacturing and semiconductor processing. It uses porous SiC material to generate uniform vacuum suction across its surface, ensuring stable clamping of flat, thin, or fragile parts like wafers, ceramics, and optical components.

We offer tailored solutions including custom sizes (from 100mm to 800mm square/round), surface roughness adjustments, integrated heating/cooling channels, and specialized vacuum port layouts to meet specific process requirements.

Porous vacuum suction cups are instrumental in the semiconductor chip production process. They enable the precise absorption and transport of ultra-thin wafers, ensuring they remain undamaged during handling while maintaining exceptionally high positioning accuracy.